課程資訊
課程名稱
高科技廠房設施設計
High-tech Facility Design 
開課學期
106-1 
授課對象
工學院  結構工程組  
授課教師
莊子壽 
課號
CIE5065 
課程識別碼
521 U3790 
班次
 
學分
3.0 
全/半年
半年 
必/選修
選修 
上課時間
星期四A,B,C(18:25~21:05) 
上課地點
土研402 
備註
本課程中文授課,使用英文教科書。限學士班三年級以上。限本系所學生(含輔系、雙修生)。與張陸滿合授
限本系所學生(含輔系、雙修生) 且 限學士班三年級以上
總人數上限:50人 
Ceiba 課程網頁
http://ceiba.ntu.edu.tw/1061CIE5065_521U3790 
課程簡介影片
 
核心能力關聯
核心能力與課程規劃關聯圖
課程大綱
為確保您我的權利,請尊重智慧財產權及不得非法影印
課程概述

The course will be taught in English. Students are encouraged to use English for asking questions and answering homework problems. However, to enhance student's learning and to facilitate the communication between instructor and students, manderin could be used in the case. Students could shift to the English version of this course for detail contents.

Basically, the purpose of this course is to provide basic knowledge needed for managing a constructed project of high-tech facility. High-Tech includes, not limited to, the advanced technologies applied in the fields of microelectronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The construction processes undertaken in high-tech manufacturing plants require
special clean-build protocols with extremely tight schedule, stringent quality and safety control as well as effective communication for integrating all the participants. The students will learn and experience the processes.

The focus of this course is on managing high-tech plant construction and engineering its facilities for life-cycle operation. Students will gain methodologies needed to meet ever-changing challenge of delivering an ultra-pure and fast moving semiconductor and related Fabs such as wafer, LED, TFT, and/or Photovoltaic. Moreover, this course will strengthen student’s understanding and background in managing high-tech fab engineering project and integrating its interdisciplinary nature.

This course is intended to offer to both graduate students and undergraduate seniors. Students in engineering, science, pharmacy, and life science will be exposed to fundamental theories and their applications in build/certify/manage the high tech manufacturing plants. Academic faculty will teach basic theories and principles. Professional industrial experts will be invited to cover the application of theories and principles in the real world practices. The contents will include lectures, hom 

課程目標
1.Differentiate the typical processes in IC, Photovoltaic and
Bio-medical Fabs.
2.Explain the interdisciplinary nature of high tech Fab construction
3.Perform Site Investigation & Mobilization.
4.Use the basic theories and principles to control Fab Design/Build schedule, to integrate time with cost and to perform cost-time trade off.
5.Classify cleanrooms in terms of various international standards.
6.Measure and verify cleanroom.
7.Establish clean-build protocols for constructing and renovating the clean room and other high-tech facilities.
8.Address the issues in automatically integrating the emergency, safety, and security systems.
9.Link to the information sources for further studies in nano/micro fabrication and research.
 
課程要求
There will be approximate 5~8 home works in spring 2016. Homework counts 20% of “Total Grade.” Students will have to preview class reading assignments. The homework is to answer the questions derived from the reading assignments, lectures, lab experiments, cleanroom tour, or field trips.

There is one (1) group term project. The group term project will be related to high-tech facility and construction management. The term project tests the student's understanding of the principal managerial concepts covered in the course within the context of a comprehensive “real-world” problem. It also provides an opportunity to develop skills for working in a project team context and communication skills. The term project counts 50% of the final grade.

A Final Exam is required on June 22, 2016. The Final Exam will be comprehensive and counted as 15% of “Total Grade.” Group Field Trip Reports (Group work- 3% and Individual work-2%) and another 10% is for class participation.
 
預期每週課後學習時數
 
Office Hours
 
指定閱讀
待補 
參考書目
1.Chang, C.Y., and Sze, S.M., ULSI Technology, McGraw-Hill Company, Inc., International Edition, 1996, New York.
2.Clifford J. Schexnayder and Richard E. Mayo, Construction Management Fundamentals, McGraw-Hill, New York, 2003, International Edition
3.Food and Drug Administration, Guideline on Sterile Drug Products Produced by Aseptic Processing, FDA, Information Branch, Rockville, Maryland, USA.
4.International Organization for Standards, ISO Standard 14644-4, part 4: Design, Construction, Start up, Geneva, Switzerland, 1999.
5.International Society of Pharmaceutical Engineering, Pharmaceutical Engineering Guide – A Guide for New Facilities, Volume 3: Sterile Manufacturing Facilities, ISPE, 2000.
6.Lurgi, S., Xu, J., and Zaslavsky, A., Future Trends in Microelectronics, Wiley, N.Y, 1999.
7.Mulhall, D., Our Molecular Future: How Nanotechnology, Robotics, Genetics, and Artificial Intelligence Will Transform Our World, Prometheus Books, Amherst, N.Y., 2002.
8.Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor Manufacturing Technology, Marcel Dekker, New York, 2000.
9.Oberlender, G. D. Project Management for Engineering and Construction, 2nd Edition, McGraw-Hill, 2000.
10.Project Management Institute (PMI), “A Guide to the Project Management Body of Knowledge,” Newtown Square, PA, USA, 2004.
11.Scherge, M., Biological Micro- and Nanotribiology: Nature’s Solutions, Sprinker, New York, 2001.
12.Van Zant, Peter, Microchip Fabrication: A Practical Guide to Semiconductor Processing, 4th ed., McGraw-Hill, New York, 2000.
13.Whyte. W., Cleanroom Technology: Fundamentals of Design, Testing, and Operation Operation, Chichester, New York, 2001.
14.半導體製造技術,Quirk Serda 著,羅文雄、蔡榮輝 譯 ,滄海(2003)
15.半導體奈米技術,龍文安 著,五南(2006)
16.半導體英語,傳田精一 著,陳連春 譯,建興(2003)
17.高科技廠務,顏登通,全華科技(2008)
 
評量方式
(僅供參考)
   
課程進度
週次
日期
單元主題
第1週
3/1  Course Introduction and Overview of High-Tech Facility